FSUSB31K8X

Low Power Dual SPST Hi-Speed USB 2.0 (480 Mbps) Switch

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	&2&K SB31 $Y&Z
Family Code	08Z
Package Type	US8
Package Description	8 LD, MOLDED, VSOP, .7MMX3.1MMX2.0MM
Pin Count	8
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Zinc
Lead Pitch	500
Minimum Lead Spacing	230
Die Fabrication
Fabrication Process Identifier	FS35C32BD
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	7500	V
ESD Charged Device Model (CDM)	1500	V

*If an attribute is listed twice, either can be used on the part.