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| General Information | | Device Marking(TOP MARK) | JB
| | | Family Code | 063 | | | Package Type | UMLP | | | Package Description | 10LD, UMLP, 1.4MM X 1.8MM (PREMOLDED) | | | Pin Count | 10 | | | FIT | 35.3 | | | Die Fabrication | | Fabrication Process Identifier | 636FS35BC3BD | | | Package Assembly* | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 7000 | V | | ESD Charged Device Model (CDM) | 2000 | V |
*If an attribute is listed twice, either can be used on the part.
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