| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
FXL
4245
|
| Family Code | 071 |
| Package Type | MLP |
| Package Description | 24LD,DQFN,JEDEC MO-241,3.5X4.5 MM |
| Pin Count | 24 |
| FIT | 5.9 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiPdAu |
| Die Fabrication |
| Fabrication Process Identifier | TBD |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
| DAP Size | 4.5X3.5 MM |
| Die Attach Type | Epoxy / EN-4620K |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |