FXLH1T45L6X

Low Voltage 1-Bit Bi-directional Level Translator with Configurable Voltage Supplies and Bushold Data Inputs (Advance Information)

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	XD
Family Code	071
Package Type	MicroPak
Package Description	MICROPAK,1.00MM X 1.45MM,6 LEADS
Pin Count	6
FIT	5.9
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Base Metal/Leadframe Material	Cu with NiPdAu
Lead Pitch	650
Minimum Lead Spacing	350
Die Fabrication
Fabrication Process Identifier	FS35C
Package Assembly*
Plating Finish Layer Thickness	0.5um - 1.5um Au
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	4000	V
ESD Charged Device Model (CDM)	2000	V

*If an attribute is listed twice, either can be used on the part.