| General Information |
| Device Marking(TOP MARK) | &E&Y
&OX34&C
&.&O&V
|
| Family Code | 071 |
| Package Type | SC70 |
| Package Description | 005, PLASTIC MOLDED SC70-5 LEAD PACKAGE, SMD |
| Pin Count | 5 |
| FIT | 5.9 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver |
| Lead Pitch | 950 |
| Minimum Lead Spacing | 450 |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |
| Die Attach Type | Epoxy / 84--1LMISR4 |
|
|
| UL Flammability Rating | UL94-V0 |
| Wire Material | Au |
| Wire Diameter | 0.8 MIL |
| DAP Size | 0.94 X 0.58 MM |
| Frame Material | Cu |
