| General Information |
| Device Marking(TOP MARK) | XG
|
| Family Code | 071 |
| Package Type | MicroPak |
| Package Description | 8LD, MICROPAK MLP, 1.6MM X 1.6MM (PREMOLDED) |
| Pin Count | 8 |
| FIT | 5.9 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiAu |
| Die Fabrication |
| Fabrication Process Identifier | 716FSC35C5L |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5um - 1.5um Au |
| Moisture Sensitivity | 1 |
| DAP Size | 8L |
| Frame Material | 1.6X1.6MM |
| Wire Material | Au |
| Wire Diameter | 0.8 MIL |