GTLP16612MTDX

CMOS 18-Bit TTL/GTLP Universal Bus Transceiver

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K GTLP16612
Family Code	08D
Package Type	TSSOP
Package Description	056,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC
Pin Count	56
FIT	1.3
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Magnesium,Silicon,Silver
Lead Pitch	500
Minimum Lead Spacing	230
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	2
Electrical Test
ESD Human Body Model (HBM)	00	V
ESD Charged Device Model (CDM)	00	V
ESD Machine Model (MM)	00	V
Package Assembly*
DAP Size	3.5X5.0MM
Frame Material	Cu
Wire Material	Au
Wire Diameter	1.0 MIL
Die Attach Type	Epoxy / QMI 519

*If an attribute is listed twice, either can be used on the part.