GTLP16616MTDX

17-Bit TTL/GTLP Bus Transceiver with Buffered Clock

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K GTLP16616
Family Code	08D
Package Type	TSSOP
Package Description	056,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC
Pin Count	56
FIT	1.3
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Magnesium,Silicon,Silver
Lead Pitch	500
Minimum Lead Spacing	230
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	2
DAP Size	4.5X5.5MM
Frame Material	Cu
Wire Material	Au
Wire Diameter	1.0 MIL
Die Attach Type	Epoxy / QMI 519

*If an attribute is listed twice, either can be used on the part.