| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
GTLP16T1655
|
| Family Code | 0W1 |
| Package Type | TSSOP |
| Package Description | 048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC |
| Pin Count | 64 |
| FIT | 2.7 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 2| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Nickel,Magnesium,Silicon,Silver |
| Die Fabrication |
| Fabrication Process Identifier | TBD |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 3 |