| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
GTLP16T1655
| |
| Family Code | 0W1 | |
| Package Type | TSSOP | |
| Package Description | 048,PLASTIC, TSSOP 6.1MM W, .50MM PH, JEDEC | |
| Pin Count | 64 | |
| FIT | 2.7 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 2| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Nickel,Magnesium,Silicon,Silver | |
| Die Fabrication |
| Fabrication Process Identifier | TBD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 3 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 00 | V |
| ESD Charged Device Model (CDM) | 00 | V |
| ESD Machine Model (MM) | 00 | V |
