GTLP8T306MTC

8-Bit LVTTL-to-GTLP Bus Transceiver

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K GTLP8T306
Family Code	08D
Package Type	TSSOP
Package Description	024,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC
Pin Count	24
FIT	1.3
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Die Fabrication
Fabrication Process Identifier	TBD
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au
Moisture Sensitivity	1
Wire Material	Au
Wire Diameter	0.9 MIL
DAP Size	2.8 X 3.5
Frame Material	Mat
Die Attach Type	Epoxy / QMI 519

*If an attribute is listed twice, either can be used on the part.