| General Information |
| Family Code | 0PC | |
| Package Type | DIP-W | |
| Package Description | 6-PIN WHITE PACKAGE WITH NO OPTIONS | |
| Pin Count | 6 | |
| FIT | 8.5 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 2540 | |
| Minimum Lead Spacing | 760 | |
| Die Fabrication |
| Fabrication Process Identifier | TBD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | NA | V |
| ESD Charged Device Model (CDM) | NA | V |
| ESD Machine Model (MM) | NA | V |
