| General Information |
| Device Marking(TOP MARK) | $Y&Z&3&K
G20N60B3D
| |
| Family Code | 024 | |
| Package Type | TO-247 | |
| Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | |
| Pin Count | 3 | |
| FIT | 13.2 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Nickel | |
| Lead Pitch | 5450 | |
| Minimum Lead Spacing | 4100 | |
| Die Fabrication |
| Fabrication Process Identifier | SEE SPEC REV | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 1 | °C/Watt |
| Moisture Sensitivity | NA | |
