HGTG30N60B3D

600V, UFS Series N-Channel IGBT with Anti-Parallel Hyperfast Diode

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K G30N60B3D
Family Code	024
Package Type	TO-247
Package Description	ADDED FOR DPP(INTERSIL) PKG ID CHANGE
Pin Count	3
FIT	13.2
Maximum Reflow Temperature	NA (thru hole)
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Nickel
Lead Pitch	5450
Minimum Lead Spacing	4100
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA

*If an attribute is listed twice, either can be used on the part.