HGTG40N60B3
600V, UFS Series N-Channel IGBT
Test Standards: - Moisture Sensitivity: NA
- Thermal Impedance: 999/999
- Physical Dimensions: TO-247
| General Information | | Device Marking(TOP MARK) | $Y&Z&3&K
G40N60B3
| | | Family Code | 024 | | | Package Type | TO-247 | | | Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | | | Pin Count | 3 | | | FIT | 13.2 | | | Maximum Reflow Temperature | NA (thru hole) | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Nickel | | | Lead Pitch | 5450 | | | Minimum Lead Spacing | 4100 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | NA | |
*If an attribute is listed twice, either can be used on the part.
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