HUF75329D3ST

20A, 55V, 0.026 Ohm, N-Channel UltraFET Power MOSFETs

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K 75329D
Family Code	021
Package Type	TO-252(DPAK)
Package Description	002, MOLDED PACKAGE, TO-252 2 LDS. SMD
Pin Count	2
FIT	6.5
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Die Fabrication
Fabrication Process Identifier	79329BZ6_6
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
DAP Size	5.08X3.74 MM
Frame Material	12SnOFC
Die Attach Type	Solder /92.5Pb
UL Flammability Rating	16MM*8.5G

*If an attribute is listed twice, either can be used on the part.