HUF75639S3

56A, 100V, 0.025 Ohm, N-Channel UltraFET Power MOSFETs


Qualification Data

 Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 999/999
  • Physical Dimensions: TO-262(I2PAK)


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
75639S
 
Family Code021 
Package TypeTO-262(I2PAK) 
Package DescriptionTO262,3LD,JEDEC VARIATION AA 
Pin Count3 
FIT6.5 
Die Fabrication
Fabrication Process Identifier78639L 
Package Assembly*
Thermal Impedance (Theta JA)999°C/Watt
Thermal Impedance (Theta JC)999°C/Watt
Moisture SensitivityNA 
DAP SizeJEOEC 
Frame Material324*225MILS 
UL Flammability RatingUL94-V0 
Wire MaterialAL 
Wire Diameter15.0 MIL 
DAP SizeRedesign 
Frame Material12SNOFC 
Die Attach TypeSolder /92.5Pb 
Wire MaterialAL 
Wire Diameter5.0 MIL 
UL Flammability RatingDPG 

*If an attribute is listed twice, either can be used on the part.

Multilanguage - Chinese Multilanguage - English Multilanguage - Japanese Multilanguage - Korean
spacespace