HUF75639S3ST

56A, 100V, 0.025 Ohm, N-Channel UltraFET Power MOSFETs


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 1
  • Thermal Impedance: 999/999
  • Physical Dimensions: TO-263(D2PAK)


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
75639S
 
Family Code021 
Package TypeTO-263(D2PAK) 
Package Description002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45) 
Pin Count2 
FIT6.5 
Die Fabrication
Fabrication Process Identifier78639L 
Package Assembly*
Thermal Impedance (Theta JA)999°C/Watt
Thermal Impedance (Theta JC)999°C/Watt
Moisture Sensitivity1 
UL Flammability RatingUL94-V0 
Die Attach TypeSolder /92.5Pb 
DAP SizeRedesign 
Frame Material12SNOFC 

*If an attribute is listed twice, either can be used on the part.

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