HUF75645P3

75A, 100V, 0.014 Ohm, N-Channel, UltraFET Power MOSFETs

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K 75645P
Family Code	021
Package Type	TO-220
Package Description	003, PLASTIC MOLDED TO220-3 LEAD PKG, THRU-HOLE
Pin Count	3
FIT	6.5
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Die Fabrication
Fabrication Process Identifier	75645L
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA
DAP Size	REDESIGN
Frame Material	12SNOFC
Wire Material	AL
Wire Diameter	20.0 MIL
Die Attach Type	Solder /92.5Pb
Wire Material	AL
Wire Diameter	5.0 MIL
UL Flammability Rating	UL94-V0
DAP Size	JSS
Frame Material	324*225 MILS

*If an attribute is listed twice, either can be used on the part.