HUF75645S3ST

75A, 100V, 0.014 Ohm, N-Channel, UltraFET Power MOSFETs

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K 75645S
Family Code	021
Package Type	TO-263(D2PAK)
Package Description	002, PLASTIC MOLDED, TO-263 PKG, CNTR LD CUT, SMD (45)
Pin Count	2
FIT	6.5
Die Fabrication
Fabrication Process Identifier	75645L
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	1
UL Flammability Rating	DPG
Die Attach Type	Solder /92.5Pb
Wire Material	AL
Wire Diameter	5.0 MIL
Wire Material	AL
Wire Diameter	20.0 MIL
DAP Size	Redesign
Frame Material	12SNOFC
UL Flammability Rating	UL94-V0
DAP Size	246*190MILS
Frame Material	L-BEND

*If an attribute is listed twice, either can be used on the part.