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ISL9N303AP3
N-Channel Logic Level UltraFET Trench MOSFETs

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Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 999/999
  • Physical Dimensions: TO-220AB

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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&3&K
N303AP
 
Family Code054 
Package TypeTO-220AB 
Package Description003, PLASTIC MOLDED TO220-3 LEAD PKG, THRU-HOLE 
Pin Count3 
FIT25.2 
Die Fabrication
Fabrication Process Identifier83374LHJ 
Package Assembly*
Thermal Impedance (Theta JA)999°C/Watt
Thermal Impedance (Theta JC)999°C/Watt
Moisture SensitivityNA 
DAP SizeJSS 
Frame Material324*225 MILS 
Wire MaterialAL 
Wire Diameter15.0 MIL 
UL Flammability RatingUL94-V0 
DAP SizeREDESIGN 
Frame Material12SNOFC 
Die Attach TypeSolder /92.5Pb 
Wire MaterialAL 
Wire Diameter5.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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