| General Information |
| Family Code | 0SM |
| Package Type | SOIC |
| Package Description | PDD STD_ 8-SOP-225 |
| Pin Count | 8 |
| FIT | 25 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver |
| Lead Pitch | 1270 |
| Minimum Lead Spacing | 760 |
| Die Fabrication |
| Fabrication Process Identifier | AR0431A |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um |
| Moisture Sensitivity | 1 |
| DAP Size | 3.56X2.41 MM |
| Frame Material | Cu |
| Wire Material | Au |
| Wire Diameter | 1.0 MIL |
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| UL Flammability Rating | UL94-V0 |
