LM258N

Dual Operational Amplifier


Qualification Data

 Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 120
  • Physical Dimensions: DIP
  • ESD HBM: 750
  • ESD CDM: 2000
  • ESD MM: 200


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&2&K
LM258N
 
Family Code0SJ 
Package TypeDIP 
Package Description008,PLASTIC, MOLDED DIP 
Pin Count8 
FIT11 
Maximum Reflow TemperatureNA (thru hole) 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Zinc,Phosphorus,Silver 
Lead Pitch2540 
Minimum Lead Spacing760 
Die Fabrication
Fabrication Process IdentifierAE0358A 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Thermal Impedance (Theta JA)120°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)750V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)200V

*If an attribute is listed twice, either can be used on the part.

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