LMV324AM14X
Quad, General Purpose, Low Cost, RRO Amplifier
Test Standards: - Moisture Sensitivity: 1
- Physical Dimensions: SOIC
- ESD HBM: 500
- ESD CDM: 1500
- ESD MM: 100
| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
LMV324
AM14
| | | Family Code | 0F2 | | | Package Type | SOIC | | | Package Description | 014, PLASTIC MOLDED SOIC-14 LD PKG, NARROW BODY, SMD | | | Pin Count | 14 | | | FIT | 11 | | | Maximum Reflow Temperature | 260C | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | | | Lead Pitch | 1270 | | | Minimum Lead Spacing | 760 | | | Die Fabrication | | Fabrication Process Identifier | TBD | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Human Body Model (HBM) | 500 | V | | ESD Charged Device Model (CDM) | 1500 | V | | ESD Machine Model (MM) | 100 | V | | Package Assembly* | |
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| UL Flammability Rating | UL94-V0 | | | Wire Material | Au | | | Wire Diameter | 0.9 MIL | | | DAP Size | 80X100 MIL | | | Frame Material | Cu | | | Die Attach Type | Epoxy / Poly 6 | |
*If an attribute is listed twice, either can be used on the part.
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