LMV358AM8X

Dual, General Purpose, Low Cost, RRO Amplifier


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: SOIC
  • ESD HBM: 500
  • ESD CDM: 2000
  • ESD MM: 50


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&2&K
LMV358
AM8
 
Family Code0F2 
Package TypeSOIC 
Package Description008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) 
Pin Count8 
FIT11 
Maximum Reflow Temperature260C 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Zinc,Phosphorus,Silver 
Lead Pitch1270 
Minimum Lead Spacing760 
Die Fabrication
Fabrication Process IdentifierTBD 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)500V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)50V
Package Assembly*
DAP Size3.56X2.41 MM 
Frame MaterialCu 
UL Flammability RatingUL94-V0 
Wire MaterialAu 
Wire Diameter1.0 MIL 

*If an attribute is listed twice, either can be used on the part.

Multilanguage - Chinese Multilanguage - English Multilanguage - Japanese Multilanguage - Korean
spacespace