| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
ML4824IS1
|
| Family Code | 0MI |
| Package Type | SOIC-Wide |
| Package Description | 016, PLASTIC MOLDED SOIC-16 LD PKG, WIDE BODY, SMD |
| Pin Count | 16 |
| FIT | 21.1 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1-Penang, 2-Unisem, 3-ATP| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Die Fabrication |
| Fabrication Process Identifier | TBD |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |