| General Information |
| Device Marking(TOP MARK) | $Y&Z&2&K
ML4824IS1
| |
| Family Code | 0MI | |
| Package Type | SOIC-Wide | |
| Package Description | 016, PLASTIC MOLDED SOIC-16 LD PKG, WIDE BODY, SMD | |
| Pin Count | 16 | |
| FIT | 21.1 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1-Penang, 2-Unisem, 3-ATP| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Die Fabrication |
| Fabrication Process Identifier | MIC12HVBP | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | NA | V |
| ESD Charged Device Model (CDM) | NA | V |
| ESD Machine Model (MM) | NA | V |
