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| General Information | | Device Marking(TOP MARK) | $Y&Z&4&K&P
MM74HC373N
MC74HC373N
| | Family Code | 041 | | Package Type | DIP | | Package Description | 020,PLASTIC, MOLDED DIP | | Pin Count | 20 | | FIT | 2.9 | | Maximum Reflow Temperature | NA (thru hole) | | MSL Rating | NA (thru hole)| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Zinc,Silver | | Lead Pitch | 2540 | | Minimum Lead Spacing | 760 | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | NA | | DAP Size | 90X110 MIL | | Frame Material | Cu | | Wire Material | Au | | Wire Diameter | 1.0 MIL | |
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| UL Flammability Rating | UL94-V0 | | Die Attach Type | Epoxy / Poly 6 |
*If an attribute is listed twice, either can be used on the part.
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