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| General Information | | Device Marking(TOP MARK) | $Y&Z&2&K
HC393SJ
| | Family Code | 041 | | Package Type | SOP | | Package Description | 014,PLAS,MOLDED EIAJ SO | | Pin Count | 14 | | FIT | 2.9 | | Maximum Reflow Temperature | 260C | | MSL Rating | 1| | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | Moisture Sensitivity | 1 | | DAP Size | 85X85 MIL | | Frame Material | Cu | | Wire Material | Au | | Wire Diameter | 0.9 MIL | | Die Attach Type | Epoxy / Poly 6 | |
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| UL Flammability Rating | UL94-V0 |
*If an attribute is listed twice, either can be used on the part.
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