| General Information |
| Device Marking(TOP MARK) | $Y&Z&4&K
MM74HC4051N
MC74HC4051N
| |
| Family Code | 041 | |
| Package Type | DIP | |
| Package Description | 016,PLASTIC, MOLDED DIP (16 1/2 LEAD) | |
| Pin Count | 16 | |
| FIT | 2.9 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Zinc,Silver | |
| Lead Pitch | 2540 | |
| Minimum Lead Spacing | 760 | |
| Die Fabrication |
| Fabrication Process Identifier | 416HCMOS60 | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 100 | °C/Watt |
| Thermal Impedance (Theta JC) | 35 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 1750 | V |
| Package Assembly* |
| Wire Material | Au | |
| Wire Diameter | 0.9 MIL | |
|
|
| UL Flammability Rating | UL94-V0 | |
| DAP Size | 100X100 MIL | |
| Frame Material | Cu | |
| Die Attach Type | Epoxy / Poly 6 | |
