MM74HC574MTC

3-STATE Octal D-Type Edge-Triggered Flip-Flop

Test Standards:

Attribute	Value
General Information
Device Marking(TOP MARK)	$Y&Z&2&K HC574
Family Code	041
Package Type	TSSOP
Package Description	020,PLASTIC, TSSOP 4.4MM W,.65MM PH,JEDEC
Pin Count	20
FIT	2.9
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	NiPdAu (Penang); Matte Sn (ATP)
Base Metal/Leadframe Material	Copper,Nickel,Silicon,Magnesium,Silver
Lead Pitch	650
Minimum Lead Spacing	350
Package Assembly*
Plating Finish Layer Thickness	0.5 - 2.0um Ni , 0.0025 - .15um Pd, >0.0025um Au; 8.0um - 13um Matte Sn
Moisture Sensitivity	1
Die Attach Type	Epoxy / QMI 519
Wire Material	Au
Wire Diameter	0.9 MIL
DAP Size	2.5Sq
Frame Material	Mat

*If an attribute is listed twice, either can be used on the part.