MMPQ2222A

NPN Multi-Chip General Purpose Amplifier

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&2&K MMPQ2222A
Family Code	055
Package Description	016, PLASTIC MOLDED SOIC-16 LD PKG, NARROW BODY, SMD
FIT	2.7
Die Fabrication
Fabrication Process Identifier	19
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	3

*If an attribute is listed twice, either can be used on the part.