| General Information |
| Device Marking(TOP MARK) | &2&K
NP14
$Y&Z
|
| Family Code | 03T |
| Package Type | US8 |
| Package Description | 8 LD, MOLDED, VSOP, .7MMX3.1MMX2.0MM |
| Pin Count | 8 |
| FIT | 11.7 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Nickel,Silicon,Magnesium,Zinc |
| Lead Pitch | 500 |
| Minimum Lead Spacing | 230 |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um |
| Moisture Sensitivity | 1 |