| General Information |
| Device Marking(TOP MARK) | X6
|
| Family Code | 03T |
| Package Type | MicroPak |
| Package Description | MICROPAK,1.60MM X 1.60MM,8 LEADS |
| Pin Count | 8 |
| FIT | 11.7 |
| Maximum Reflow Temperature | 260C |
| MSL Rating | 1| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiAu |
| Die Fabrication |
| Fabrication Process Identifier | 3T635CTINYP |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5um - 1.5um Au |
| Moisture Sensitivity | 1 |