| General Information |
| Die Revision Level | Y | |
| Device Marking(TOP MARK) | A3
| |
| Family Code | 06Y | |
| Package Type | MicroPak | |
| Package Description | MICROPAK,1.00MM X 1.45MM,6 LEADS | |
| Pin Count | 6 | |
| FIT | 2 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | NiAu | |
| Base Metal/Leadframe Material | BT Substrate with NiPdAu | |
| Lead Pitch | 650 | |
| Minimum Lead Spacing | 350 | |
| Die Fabrication |
| Fabrication Process Identifier | 3P6C5LBPOAPD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 0.5um - 1.5um Au | |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Charged Device Model (CDM) | NA | V |
| ESD Machine Model (MM) | NA | V |
