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| General Information | | Device Marking(TOP MARK) | &E&Y
&OS14&C
&.&O&V
| | | Family Code | 06Y | | | Package Type | SC70 | | | Package Description | 005, PLASTIC MOLDED SC70-5 LEAD PACKAGE, SMD | | | Pin Count | 5 | | | FIT | 2 | | | MSL Rating | | | | | Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Base Metal/Leadframe Material | Iron,Nickel,Manganese,Cobalt,Silicon,Silver | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Moisture Sensitivity | 1 | | | Electrical Test | | ESD Charged Device Model (CDM) | 2000 | V | | Package Assembly* | | Wire Material | Au | | | Wire Diameter | 0.8 MIL | | | DAP Size | 0.0390X0.0260 IN | | | Frame Material | Alloy42 | | | Die Attach Type | Epoxy / 84--1LMISR4 | | |
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| UL Flammability Rating | UL94-V0 | | | DAP Size | 0.94 X 0.58 MM | | | Frame Material | Cu | | |
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| UL Flammability Rating | UL94-V0 | |
*If an attribute is listed twice, either can be used on the part.
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