| General Information |
| Die Revision Level | Z | |
| Device Marking(TOP MARK) | &E&Y
&OZ00&C
&.&O&V
| |
| Family Code | 03P | |
| Package Type | SC70 | |
| Package Description | 005, PLASTIC MOLDED SC70-5 LEAD PACKAGE, SMD | |
| Pin Count | 5 | |
| Die Size X | 30 | MLL |
| Die Size Y | 17 | MLL |
| Transistor Count | 41 | |
| Logic Gate Count | 10 | |
| FIT | 2.9 | |
| Maximum Reflow Temperature | 260C | |
| MSL Rating | 1| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 950 | |
| Minimum Lead Spacing | 450 | |
| Die Fabrication |
| Fabrication Process Identifier | 3P6C5LBPOAD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 435 | °C/Watt |
| Thermal Impedance (Theta JC) | 135 | °C/Watt |
| Moisture Sensitivity | 1 | |
| Electrical Test |
| ESD Human Body Model (HBM) | 4000 | V |
| ESD Charged Device Model (CDM) | 1500 | V |
| ESD Machine Model (MM) | 400 | V |
| Package Assembly* |
| DAP Size | 0.0370X0.0260 IN | |
| Frame Material | Alloy42 | |
| Die Attach Type | Epoxy / 84--1LMISR4 | |
| DAP Size | 0.94 X 0.58 MM | |
| Frame Material | Cu | |
|
|
| UL Flammability Rating | UL94-V0 | |
|
|
| UL Flammability Rating | UL94-V0 | |
| Wire Material | Au | |
| Wire Diameter | 0.8 MIL | |
| Wire Material | Au | |
| Wire Diameter | 0.8 MIL | |
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