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NC7SZ175L6X
TinyLogic UHS D-Type Flip-Flop with Asynchronous Clear

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Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: 1
  • Physical Dimensions: MicroPak

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AttributeValue
General Information
Device Marking(TOP MARK)C4
Family Code03P
Package TypeMicroPak
Package DescriptionMICROPAK,1.00MM X 1.45MM,6 LEADS
Pin Count6
FIT2.9
Maximum Reflow Temperature260C
MSL Rating1|
Restriction of Hazardous Substance
Standard Plating FinishNiAu
Base Metal/Leadframe MaterialBT Substrate with NiPdAu
Lead Pitch650
Minimum Lead Spacing350
Package Assembly*
Plating Finish Layer Thickness0.5um - 1.5um Au
Moisture Sensitivity1

*If an attribute is listed twice, either can be used on the part.

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