NDP6020P

-20V P-Channel Logic Level Enhancement Mode Field Effect Transistor

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y&Z&3&K NDP6020P
Family Code	057
Package Description	003, PLASTIC MOLDED TO220-3 LEAD PKG, THRU-HOLE
FIT	10.7
Die Fabrication
Fabrication Process Identifier	8CB
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA
Wire Material	AL
Wire Diameter	15.0 MIL
DAP Size	REDESIGN
Frame Material	12SNOFC
Die Attach Type	Solder /92.5Pb
Wire Material	AL
Wire Diameter	6.0 MIL
UL Flammability Rating	UL94-V0
DAP Size	JSS
Frame Material	324*225 MILS

*If an attribute is listed twice, either can be used on the part.