| General Information |
| Device Marking(TOP MARK) | PN
2222A
-&3
| |
| Family Code | 0S2 | |
| Package Type | TO-92 | |
| Package Description | 3 LD PLASTIC PKG (APK=AM) | |
| Pin Count | 3 | |
| FIT | 4.2 | |
| Die Fabrication |
| Fabrication Process Identifier | DB0815A | |
| Package Assembly* |
| Thermal Impedance (Theta JA) | 999 | °C/Watt |
| Thermal Impedance (Theta JC) | 999 | °C/Watt |
| Moisture Sensitivity | NA | |