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| General Information | | Device Marking(TOP MARK) | $Y&Z&3&K
RHRG75120
| | | Family Code | 0P5 | | | Package Type | TO-247 | | | Package Description | ADDED FOR DPP(INTERSIL) PKG ID CHANGE | | | Pin Count | 2 | | | FIT | 24.4 | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | NA | |
*If an attribute is listed twice, either can be used on the part.
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