SG5841SZ_SB82167

Highly-Integrated Green-Mode PWM Controller

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	SG5841SZ E3&6&3&Z
Family Code	0GD
Package Type	SOIC
Package Description	008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1)
Pin Count	8
Maximum Reflow Temperature	260C
Restriction of Hazardous Substance
Standard Plating Finish	Matte Sn
Base Metal/Leadframe Material	Copper,Iron,Zinc,Phosphorus,Silver
Lead Pitch	1270
Minimum Lead Spacing	760
Die Fabrication
Fabrication Process Identifier	ESMC
Package Assembly*
Plating Finish Layer Thickness	8.0um - 13um
Thermal Impedance (Theta JA)	141	°C/Watt
Thermal Impedance (Theta JC)	80	°C/Watt
Moisture Sensitivity	1
Electrical Test
ESD Human Body Model (HBM)	3	V
ESD Machine Model (MM)	250	V

*If an attribute is listed twice, either can be used on the part.