SG6516SZ

PC Power Supply Supervisors


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 3
  • Physical Dimensions: SOIC
  • ESD HBM: 4500
  • ESD MM: 200


AttributeValueUOM
General Information
Device Marking(TOP MARK)SG6516SZ
D1&6&3&Z
 
Family Code0GA 
Package TypeSOIC 
Package Description014, PLASTIC MOLDED SOIC-14 LD PKG, NARROW BODY, SMD 
Pin Count14 
FIT250 
Maximum Reflow Temperature260C 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Zinc,Phosphorus,Silver 
Lead Pitch1270 
Minimum Lead Spacing760 
Die Fabrication
Fabrication Process IdentifierTBD 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Moisture Sensitivity3 
Electrical Test
ESD Human Body Model (HBM)4500V
ESD Machine Model (MM)200V

*If an attribute is listed twice, either can be used on the part.

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