SGH80N60UFDTU

Discrete, High Performance IGBT with Diode

Test Standards:

Attribute	Value	UOM
General Information
Device Marking(TOP MARK)	$Y G80N60 UFD&E&3&K
Family Code	0S4
Package Type	TO-3PN
Package Description	MOLDED PACKAGE, TT-3P,3LDS
Pin Count	3
FIT	133
Die Fabrication
Fabrication Process Identifier	SEE SPEC REV
Package Assembly*
Thermal Impedance (Theta JA)	999	°C/Watt
Thermal Impedance (Theta JC)	999	°C/Watt
Moisture Sensitivity	NA
DAP Size	NON-GROOVE
Frame Material	NON-CUT BARR
Wire Material	AL
Wire Diameter	15.0 MIL
Wire Material	AL
Wire Diameter	6.0 MIL

*If an attribute is listed twice, either can be used on the part.