SGP100SZ

Primary-side-control PWM controller


Qualification Data

 Test Standards:

  • Moisture Sensitivity: 1
  • Thermal Impedance: 68
  • Physical Dimensions: SOIC
  • ESD HBM: 4500
  • ESD MM: 200


AttributeValueUOM
General Information
Device Marking(TOP MARK)SGP100SZ
F3&6&3&Z
 
Family Code0GT 
Package TypeSOIC 
Package Description008, PLASTIC MOLDED, SOIC-8 PKG, NARROW BODY, SMD (S1) 
Pin Count8 
Maximum Reflow Temperature260C 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Zinc,Phosphorus,Silver 
Lead Pitch1270 
Minimum Lead Spacing760 
Die Fabrication
Fabrication Process IdentifierTBD 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Thermal Impedance (Theta JC)68°C/Watt
Moisture Sensitivity1 
Electrical Test
ESD Human Body Model (HBM)4500V
ESD Machine Model (MM)200V

*If an attribute is listed twice, either can be used on the part.

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