SGP23N60UFTU

Discrete, High Performance IGBT


Qualification Data

 Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 999/999
  • Physical Dimensions: TO-220


AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y
G23&3&K
N60UF
 
Family Code0S4 
Package TypeTO-220 
Package Description3 LD PLASTIC W/EXPOSED HEATSNK 
Pin Count3 
FIT133 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Die Fabrication
Fabrication Process IdentifierSEE SPEC REV 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Thermal Impedance (Theta JA)999°C/Watt
Thermal Impedance (Theta JC)999°C/Watt
Moisture SensitivityNA 
DAP SizeJSS 324*225 MILS 
Frame MaterialBARE LONGER LEAD 
Wire MaterialAL 
Wire Diameter6.0 MIL 
Wire MaterialAL 
Wire Diameter12.0 MIL 

*If an attribute is listed twice, either can be used on the part.

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