SGP23N60UFTU
Discrete, High Performance IGBT
Test Standards: - Moisture Sensitivity: NA
- Thermal Impedance: 999/999
- Physical Dimensions: TO-220
| General Information | | Device Marking(TOP MARK) | $Y
G23&3&K
N60UF
| | | Family Code | 0S4 | | | Package Type | TO-220 | | | Package Description | 3 LD PLASTIC W/EXPOSED HEATSNK | | | Pin Count | 3 | | | FIT | 133 | | |
| Restriction of Hazardous Substance | | Standard Plating Finish | Matte Sn | | | Die Fabrication | | Fabrication Process Identifier | SEE SPEC REV | | | Package Assembly* | | Plating Finish Layer Thickness | 8.0um - 13um | | | Thermal Impedance (Theta JA) | 999 | °C/Watt | | Thermal Impedance (Theta JC) | 999 | °C/Watt | | Moisture Sensitivity | NA | | |
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| DAP Size | JSS 324*225 MILS | | | Frame Material | BARE LONGER LEAD | | | Wire Material | AL | | | Wire Diameter | 6.0 MIL | | | Wire Material | AL | | | Wire Diameter | 12.0 MIL | |
*If an attribute is listed twice, either can be used on the part.
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