| General Information |
| Device Marking(TOP MARK) | SGP400DZ
B3&6&3&Z
| |
| Family Code | 0GT | |
| Package Type | DIP | |
| Package Description | 008,PLASTIC, MOLDED DIP | |
| Pin Count | 8 | |
| Maximum Reflow Temperature | NA (thru hole) | |
| MSL Rating | NA (thru hole)| | |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn | |
| Base Metal/Leadframe Material | Copper,Iron,Zinc,Phosphorus,Silver | |
| Lead Pitch | 2540 | |
| Minimum Lead Spacing | 760 | |
| Die Fabrication |
| Fabrication Process Identifier | TBD | |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 13um | |
| Thermal Impedance (Theta JA) | 135 | °C/Watt |
| Thermal Impedance (Theta JC) | 67 | °C/Watt |
| Moisture Sensitivity | NA | |
| Electrical Test |
| ESD Human Body Model (HBM) | 3 | V |
