| General Information |
| Device Marking(TOP MARK) | $Y
&3
TIP112
|
| Family Code | 0S3 |
| Package Type | TO-220 |
| Package Description | 3LD PLASTIC W/EXPOSED HEATSINK (SINGLE GAUGE) |
| Pin Count | 3 |
| FIT | 11.5 |
| Maximum Reflow Temperature | NA (thru hole) |
| MSL Rating | NA (thru hole)| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver |
| Die Fabrication |
| Fabrication Process Identifier | DC1692C |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 25um |
| Moisture Sensitivity | NA |
| DAP Size | SINGLE STRAND |
| Frame Material | PDD |
|
| Wire Material | AL |
| Wire Diameter | 5.0 MIL |
