| General Information |
| Device Marking(TOP MARK) | 2N
3904
-&3
|
| Family Code | 0S2 |
| Package Type | TO-92 |
| Package Description | 3 LD PLASTIC PKG (APK=AM) |
| Pin Count | 3 |
| FIT | 4.2 |
| Maximum Reflow Temperature | NA (thru hole) |
| MSL Rating | NA (thru hole)| |
| Restriction of Hazardous Substance |
| Standard Plating Finish | Matte Sn |
| Base Metal/Leadframe Material | Copper,Iron,Phosphorus,Silver |
| Lead Pitch | 1270 |
| Minimum Lead Spacing | 810 |
| Die Fabrication |
| Fabrication Process Identifier | DB3904B |
| Package Assembly* |
| Plating Finish Layer Thickness | 8.0um - 18um |
| Moisture Sensitivity | NA |