Fairchild Semiconductor
74ACT04PC
Hex Inverter

Qualification Data

Fairchild Product Reliability Report

    Test Standards:

  • Moisture Sensitivity: NA
  • Thermal Impedance: 44/134
  • Physical Dimensions: DIP
  • ESD HBM: 5500
  • ESD CDM: 2000
  • ESD MM: 350
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AttributeValueUOM
General Information
Device Marking(TOP MARK)$Y&Z&4&K
74ACT04PC
 
Family Code08C 
Package TypeDIP 
Package Description014,PLASTIC, MOLDED DIP 
Pin Count14 
FIT2.5 
Maximum Reflow TemperatureNA (thru hole) 
MSL RatingNA (thru hole)| 
Restriction of Hazardous Substance
Standard Plating FinishMatte Sn 
Base Metal/Leadframe MaterialCopper,Iron,Phosphorus,Zinc,Silver 
Die Fabrication
Fabrication Process Identifier8C680CSMCD 
Package Assembly*
Plating Finish Layer Thickness8.0um - 13um 
Thermal Impedance (Theta JA)134°C/Watt
Thermal Impedance (Theta JC)44°C/Watt
Moisture SensitivityNA 
Electrical Test
ESD Human Body Model (HBM)5500V
ESD Charged Device Model (CDM)2000V
ESD Machine Model (MM)350V
Package Assembly*
DAP Size65X65 MIL 
Frame MaterialCu194 
Wire MaterialAu 
Wire Diameter0.9 MIL 
UL Flammability RatingUL94-V0 
Die Attach TypeEpoxy / Poly 6 

*If an attribute is listed twice, either can be used on the part.

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